UV laser processing is achieved by photochemical ablation. Strong energy of the laser can interrupt the bonding between atoms or molecules and transform them into small molecules. Small molecule is easy to evaporate.
1.Excellent beam quality, smaller focused spot size, ultra-fine marking;
2.Since most materials can absorb the UV light, the range of application is much more wider;
3.Small heat-affected region, no thermal effects, no burning issue;
4.High speed, high efficiency;
5.Stable performance , small size, low power consumption.
Because focused UV light spot size is small and the heat-affected area during processing is mimimum, it is used in ultra-fine marking and special material’s marking. It is the first choice of the customers who have higher expectations of marking effect. Since UV laser did not produce any thermal effects and burning issues, the result of the marking is precise , smooth and steep. A lot of material will absorb UV light at 355nm except Copper, so UV laser are suitable for processing more types of material .
Mainly used in high-end ultra-refining market: cosmetics, pharmaceuticals, food and other polymer bottles’ surface. Marking effect is fine, clear and solid, which is better than the injekt printing and no pullution produced.
Also used in marking and dicing flexible PCB board, drilling tiny hole or blind-hole on silicon wafers, two-dimensional coding on LCD, glass container surface, metal surface coating, plastic keys, electronic components, gifts, communication equipment, construction materials .